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Low-carbon Circular Aluminum


Low-carbon Circular Aluminum

3C aluminum for electronic products, specially designed for electronic product use. Compared with traditional aluminum, it has the characteristics of more environmental protection, more beautiful and higher strength.

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KEY BENEFITS

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High Strength

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Anodizing without 
shading

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Low cost

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Low carbon and 
environmental protection

Exterior Pieces

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Alloy: 6063 R
Temper: O T4 T6
Density: 2.69 g/cm3
Poisson's Ratio: 0.33
Elastic Modulus: 68.3Gpa
Electrical Conductivity: 53%IACS
Thermal Conductivity: 202W/(m.K)

Si

Fe

Cu

Mn

Mg

Cr

Zn

Ti

Other element

Unit

Total

upper limit

0.6

0.35

0.1

0.1

0.9

0.1

0.1

0.1

0.05

0.16

lower limit

0.2

-

-

-

0.45

 

-

-

-

-

180# zirconium sandblasting anode has no material pattern, which can meet the needs of high anode appearance.
Good dimensional stability, no deformation after CNC machining.
It can be continuously stamped and formed, suitable for mobile phones, laptop and other exterior products.

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Alloy: 7S50
Temper: O T6
Density: 2.8 g/cm3
Poisson's Ratio: 0.33
Elastic Modulus: 71Gpa
Electrical Conductivity: 33%IACS
Thermal Conductivity: 130W/(m.K)

150# zirconium sandblasting anode has no material pattern, which can meet the needs of high anode appearance.
High strength, suitable for mobile phone frames and other products.
The corrosion resistance of the machining process is better than that of similar 7 series alloys.

Si

Fe

Cu

Mn

Mg

Cr

Zn

Ti

Other element

Unit

Total

upper limit

0.2

0.4

0.1

0.1

1.8

0.05

6.5

0.1

0.05

0.16

lower limit

-

-

-

-

1.0

 

5.0

-

-

-

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Alloy: 5052 RC
Temper: H32
Tensile strength: 210-245 MPa
Yield strength: ≥7%
Thermal conductivity: 126 W/(m.K)

It can meet the general anode appearance needs of 120# iron sand blasting anode

Application

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Mobile Case

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Laptop computer case

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Pad case

Structural Parts

KEY BENEFITS

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High strength, 
high thermal conductivity

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High elongation

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Dimensionally stable

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Alloy: 5B59
Temper: O H32 H34 H36 H38
Density: 2.67 g/cm3
Poisson's ratio: 0.33
Elastic modulus: 71.2Gpa
Electrical conductivity: 53%IACS
Thermal conductivity: 125W/(m.K)

Si

Fe

Cu

Mn

Mg

Cr

Zn

Ti

Other element

Unit

Total

upper limit

0.2

0.35

0.25

1.0

6.0

0.05

0.05

0.05

0.05

0.15

lower limit

-

-

-

0.2

5.0

-

-

-

-

-

High strength, good molding, low residual stress, good flatness, adapt to the needs of various 3C products

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Alloy: 5182
Temper: O H32 H34
Density: 2.65 g/cm3
Poisson's ratio: 0.33
Elastic modulus: 70.9Gpa
Electrical conductivity: 35%IACS
Thermal conductivity: 123W/(m.K)

Si

Fe

Cu

Mn

Mg

Cr

Zn

Ti

Other element

Unit

Total

upper limit

0.2

0.35

0.15

0.5

5.0

0.1

0.25

0.1

0.05

0.15

lower limit

-

-

-

0.2

4.0

-

-

-

-

-

It has medium to high strength and can be continuously stamped
Low residual internal stress, suitable for the design and use of small size products
It can meet 90 degree bending, but 180 degree bending is prone to fracture.

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6 series 7 series products are strong High degree,but bentpoor performance;
SUS304 stainless steel Steel strength is high, but Low thermal conductivity;
General 5 series productsLow strength, and punch Poor flatness after pressing.Produced as a back-light Product, surface quality Instability;

Application

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Phone midplate

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Keyboard deck

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